| Machine Module Specification | ||||||
| ● | Workholder system | |||||
| Track width | : 20 – 85mm | |||||
| Indexing pitch | : Programmable | |||||
| ● | Wafer Table | |||||
| Max. wafer handling | : 8” | |||||
| Auto θ alignment | : ± 10° range, 0.002° / step | |||||
| ● | Bondhead | |||||
| Bond force | : 25 – 300g | |||||
| Resolution | : 0.2µm (X), 0.5µm (Y), 0.5µm (Z) | |||||
| ● | Vision system | |||||
| PR system | : 256 grey levels | |||||
| Resolution | : 512 x 512pixels | |||||
| PR accuracy | : ± 1 / 4 pixel (± 1µm @ FOV 2mm) | |||||
| Angle tolerance | : ± 10° | |||||
| ● | Facilities | |||||
| Voltage | : 110 / 200 / 220 / 240VAC | |||||
| Power consumption | : 2500W | |||||
| Compressed air | : Min. 6 bar (87 PSI) | |||||
| ● | Dimension & weight (standard configuration) | |||||
| W x D x H | : 1680 x 1220 x 2080mm | |||||
| Weight | : 1300kg | |||||
AD830改造机器基本参数